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  • Heat conduction without substrate double-sided adhesive
Heat conduction without substrate double-sided adhesive

Category:Thermal conductive adhesive tape

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Details

        Product name: heat conduction double-sided adhesive without substrate


        Product structure:


Features: The product has good thermal conductivity and electrical insulation, high flexibility of surface bonding, high bonding strength for most substrates, good anti-aging performance, high shear strength, high bonding strength.
Product Application: LCD module of PCB chip for smart phone/tablet; The PEP module; OLED module; Heat conduction of secondary battery and charger modules.


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