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Product name: heat conduction double-sided adhesive without substrate
Product structure:
Features: The product has good thermal conductivity and electrical insulation, high flexibility of surface bonding, high bonding strength for most substrates, good anti-aging performance, high shear strength, high bonding strength.
Product Application: LCD module of PCB chip for smart phone/tablet; The PEP module; OLED module; Heat conduction of secondary battery and charger module