Product name: omni-directional conductive foam

        Product structure:

Features: X,Y,Z axis direction has good conductivity, and has good compressibility and resilience, can solve the large gap of grounding conduction problem.
Product Application: It is applied to smart phones, tablet computers, notebook computers, servers and other electronic devices, such as conductive grounding of the back of LCM module, FPC grounding, PCB and shell grounding, etc.