Product name: heat conduction double-sided adhesive without substrate

        Product structure:

Features: The product has good thermal conductivity and electrical insulation, high flexibility of surface bonding, high bonding strength for most substrates, good anti-aging performance, high shear strength, high bonding strength.
Product Application: LCD module of PCB chip for smart phone/tablet; The PEP module; OLED module; Heat conduction of secondary battery and charger modules.