Thermal conductivity gel glue

Thermal conductivity gel glue

        Product name: thermal conductivity gel glue


        Thermal conductivity gel is a gelatinous thermal conductivity material made of silica gel composite thermal conductivity filler after stirring, mixing and encapsulation


Features: High thermal conductivity and low thermal resistance easy to adjust; Good flexibility and thixotropy for assembly; Excellent electrical insulation performance and reliability.
Application: Recommends for heat conduction and coating, protection of PCB, IC and other components.


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