Thermal conductivity gel glue
Product name: thermal conductivity gel glue
Thermal conductivity gel is a gelatinous thermal conductivity material made of silica gel composite thermal conductivity filler after stirring, mixing and encapsulation
Features: High thermal conductivity and low thermal resistance easy to adjust; Good flexibility and thixotropy for assembly; Excellent electrical insulation performance and reliability.
Application: Recommends for heat conduction and coating, protection of PCB, IC and other components.